TCMDA: Advanced Data Collection and Analysis for Thermal Conductivity Microscope

The Modified Data Collection and Analysis of using Thermal Conductivity Microscopes (TCMDA) software suite facilitates the measurement of thermal conductivity and diffusivity using a Thermal Conductivity Microscope (TCM). The "data collection" component gathers thermal wave phase and amplitude profiles by setting up parameters such as thermal wave frequency and laser scan distance. The "data analysis" component then compares these profiles with predictions from an enhanced analytical model, extracting best-fit parameters like thermal conductivity, thermal diffusivity, and interface thermal resistance. This upgraded model improves efficiency and accuracy, and can handle multi-layered materials, unlike previous models limited to two-layer structures. Ideal for researchers focused on thermal transport properties of post-irradiated materials, TCMDA offers a more flexible and accurate solution for complex material analysis. While the core algorithm is publicly documented, the detailed code offers unique value and flexibility, potentially benefiting from further development for commercial use.

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